How to solve the problem of electronic hardware sealing silicone encapsulation?

The problem of silicone encapsulation of electronic hardware seals is usually caused by insufficient adhesion between silica gel and substrate or unsuitable environmental conditions. To solve this problem, many aspects such as material selection, process parameters and environmental factors should be considered comprehensively. To deal with this problem:
First of all, we need to make it clear that there may be many reasons for the opening of silicone rubber, such as the quality of raw materials, the improper setting of molding parameters, and the non-standard operation methods. Therefore, to solve the problem of opening glue needs to start from many aspects.

First, the selection and treatment of raw materials 1, first of all to ensure that the selected silicone material and the substrate compatibility is good, can maintain stable performance in different temperature, humidity and chemical environments. In addition, the adhesion of silicone is also the key, you can choose silicone products with high adhesion. The quality of silicone directly affects the effect of the coating, therefore, it is important to choose silicone materials with good elasticity and aging resistance. 2, the surface of the hardware is treated. Before the adhesive coating, the surface of the hardware should be cleaned to remove impurities such as oil and dust to improve the adhesive force. At the same time, a base coating can be applied to further enhance the adhesion between the silica gel and the hardware.

1. First of all, we must ensure that the selected silica gel material has good compatibility with the substrate and can maintain stable performance under different temperature, humidity and chemical environments. In addition, the adhesion of silicone is also the key, you can choose silicone products with high adhesion. Therefore, the vulcanization time should be set reasonably according to the type and thickness of silica gel to ensure that the silica gel is fully vulcanized. 2, control the molding temperature. Forming temperature is too low may lead to insufficient adhesion between silica gel and hardware, resulting in unadhesive. Therefore, the molding temperature should be reasonably set according to the type and thickness of the silicone to ensure that the silicone can fully flow and be closely combined with the hardware during the molding process.

1. Operators should keep their hands clean to avoid introducing impurities or contaminating silicone during operation. 2. When applying the base coat, the process should be standardized to avoid contamination or uneven application of the base coat. 3. It is necessary to establish a strict quality control system to conduct comprehensive testing and control of raw materials, processes and finished products to ensure the stability and reliability of products

In addition, in order to further improve the effect of silicone encapsulation, you can consider adding some additives to the silicone, such as leveling agents, defoaming agents, etc., to improve the fluidity and stability of the silicone. At the same time, the production environment is controlled, such as keeping the temperature and humidity of the production workshop stable, to avoid the influence of the external environment on the silicone products. In short, to solve the problem of electronic hardware seals silica gel packaging glue needs to comprehensively consider material selection, process parameters, environmental factors and quality control and other aspects, by optimizing the process and materials, to ensure the adhesion and sealing performance between silica gel and the substrate, so as to solve the problem of opening glue.