Silicone encapsulation process flow
The silicone coating process is a complex and delicate process, which involves several key steps and requires strict operating specifications and quality control.
The following is a detailed analysis of the silicone encapsulation process.
Preparation of materials: Prepare the photoelectric devices and silica gel to be packaged.
Devices should be cleaned and dried to ensure that the surface is clean and pollution-free.
Silica gel needs to be selected according to specific packaging requirements, such as according to the required hardness, transparency, chemical resistance and so on.
Vacuum gluing: Put the prepared silicone into the gluing machine and establish a negative pressure environment through the vacuum pump.
The photoelectric device is placed on the positioning table of the gluer, and the gluer mouth is closely fitted to the package area of the device.
Then open the silicone injection valve to fill the entire package area with silicone.
In the process of gluing, it is necessary to maintain a stable vacuum negative pressure environment to avoid the generation of bubbles.
Cured silica gel: Silica gel generally needs to be cured at a certain temperature.
According to the different types of silicone, its curing time and temperature will also be different.
Under normal circumstances, the curing time ranges from tens of minutes to several hours.
During the curing process, uniformity of temperature needs to be ensured, which can be controlled by the use of heating plates or ovens.
Removal of impurities: After the silicone is cured, some uneven interfaces or impurities may be left.
The package can be made more flat and beautiful by removing excess from the silicone edges, as well as by using specific tools to remove uneven interfaces.
Test and quality inspection: After the packaging is complete, the photoelectric device needs to be tested and quality inspection.
Common test items include electrical performance test, package effect inspection, mechanical strength test and so on.
The process of silica gel encapsulation involves raw material preparation, mixing, encapsulation, curing treatment and product inspection and packaging.
The inspection is carried out based on specific package requirements to ensure that the package quality meets the requirements.
Finally, product inspection and packaging.
The appearance inspection and quality sampling of coated products are carried out to ensure that they meet the standards and requirements.
Qualified products are packaged for storage and transportation.
In the field of electronics, the silicone coating process is particularly widely used.
With the popularization and upgrading of electronic products, the sealing and protection requirements of electronic components are becoming higher and higher.
The liquid silicone encapsulation process can be used for the sealing and protection of circuit boards and electronic components to prevent the intrusion of external factors such as moisture and dust, thereby improving the durability and reliability of electronic products.
In addition, the silicone encapsulation process can also be applied to the packaging of key components such as sensors and batteries to ensure their stable operation in harsh environments.
In short, the silicone coating process is a complex and fine process that requires strict operating specifications and quality control.
Through continuous optimization and improvement of the process, we can produce high-quality and high-performance silicone coated products to meet the diversified needs of the market.
It can not only improve the durability and reliability of the object, but also provide the object with a beautiful appearance and texture.
